Description
SUNSHINE RELIFE RL-039 BGA/IC Adhesive Remove Liquid (20ML)
-BGA-IC Adhesive Remove Liquid, High-effect
-For the mobile phone BGA/IC resin sealant
-Softened and removed, Scientific formula
-Does not hurt the Motherboard or Component
SUNSHINE RELIFE RL-039 BGA/IC Adhesive Remove Liquid (20ML)
RM36.00
SUNSHINE RELIFE RL-039 BGA/IC Adhesive Remove Liquid (20ML)
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