Description
-Modular design，A variety of combined modules, common modules on the base, good scalability, easy to expand new modules
-The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick
-Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life and uniform temperature
-360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency
-The module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take
-Hollow heat dissipation design, high temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect
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