Description
Features:
- Removable blade design allows for the removal of black adhesive without scratching IC chips or prying off PCB pads; suitable for removing adhesive from CPUs, hard drives, and various BGA chips.
- The thin blade design protects pads and easily inserts under the chip to remove residual adhesive; the handle eliminates the risk of prying off pads or scratching circuits.
- Essential for chip repair and rework: Developed specifically for stubborn black adhesive under CPUs and ICs, effectively reducing the risk of repair failures
- High-temperature resistant and chip-safe; made of flexible specialty engineering plastic that won’t scratch the IC surface, making it easy to remove black adhesive from motherboard pads
- The material softens when heated, enhancing its flexibility and allowing it to conform to the surface for easy adhesive removal and cleaning
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