Description
• The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes
• Cure within 1 min/under 150°C or within 5 min/under 100°C automatically
• Being softened under high temperature, simplify the process of rework
• Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device
Reviews
There are no reviews yet.