Description
Features:
-High-Temperature Resistant: Made to withstand soldering and hot air temperatures without melting or deforming
-Soft & Flexible: Durable silicone twists, folds, and stretches for easy storage and use
-Sloped Arc Design: Beveled surface keeps chips and stencils perfectly aligned during reballing
-Non-Deformable Material: Bounces back to its original shape, even after repeated use
-Universal Compatibility: Applicable to the majority of CPU/IC chips, motherboards, and phone repair stencils
Use for:
-Phone Repair Technicians: Essential for BGA/CPU reballing and chip-level soldering
-PCB & BGA Repair Pros: Perfect for holding chips steady during hot air rework
-Repair Shop Owners: Durable, reusable mat that saves time and prevents chip damage
-DIY Electronics Hobbyists: Makes home reballing projects cleaner and more precise
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